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Participation in the "Industry of the future" program by GIFAS

On Tuesday January 4, 2022, Exxelia participated in the launch of the second wave around the "Industry of the future" program for the Grand Est region at the Bologna site of LISI AEROSPACE.

GIFAS"Industry of the Future" Program

Launched in 2019, for four years, financed by the government, as well as the Regions, OPCO2i, companies and GIFAS: the "Industry of the Future" program aims to strengthen the competitiveness of the sector through the introduction of new 4.0 technologies. This program, which is the result of close collaboration between the Industrial Committee, the GEAD and the AERO-PME Committee, is a continuation of the "Industrial Performance" program. Its objective is to use new digital and production technologies in all phases of a product's life. In this respect, the Exxelia sites of Illange and Marmoutier are concerned.


Frédéric BOIS, in his capacity as Director of the Exxelia site of Illange, was able to actively participate in the exchanges. The objectives were numerous, namely : 

  • Inventory of the industrial maturity of our site of Illange.
  • Analysis.
  • Recommendation and deployment of Industry 4.0 tools best suited to the situation of each company.

 

Thanks to the Grand Est region which contributes to the financing of the program, to the partners: Cetim - Technical center of mechanical industries, BoostAeroSpace SAS, UIMM, DREETS, OPCO 2i, and of course to AERIADES as a facilitator of the aeronautical sector in the region.

Did you know that?

At Exxelia, we use AI: Artificial Intelligence (click to discover the article - FR version).

Published on 04 Jan 2022 by Stephane PERES

New Ultra-Broadband Capacitor Series

Exxelia launches its three new Ultra-Broadband Capacitor Series at European Microwave Week 2019 in Paris August 26th, 2019 – Paris, France - Exxelia, a leading global designer and manufacturer of high reliability passive components  pleased to announce the launch of its new ultra-broadband series UBZ, UBL and XBL at the European Microwave Week tradeshow in Paris from October 1-3, 2019. Thanks to its strong experience in MLCC manufacturing, Exxelia extends its RF capacitors product offer by developing the three ultra-broadband series XBL, UBL and UBZ.  Available in standard EIA sizes compatible with SMT pick & place and with any soldering processes thanks to its highly reliable ceramic material, Exxelia new ultra-broadband series ensure an ultra-low insertion loss and excellent return loss over a wide bandwidth up to 40GHz. TECHNICAL CHARACTERISTICS                                                           CIRCUIT APPLICATIONS EIA 0201 and 0402 Case sizes                                                       DC Blocking, Coupling and Bypassing Capacitance: 100nF Low insertion loss up to 40 GHz RoHS Compliant APPLICATIONS Optoelectronics / High-speed data Broadband test equipment & applications Broadband microwave / millimeter wave amplifiers and oscillators The XBL, UBL and UBZ Ultra-Broadband series are now available for orders.  

Revolutionary Exxelia MML™ Ultra-High Energy Density Film Capacitors

Discover the power of MML™ technology The best performing film capacitors on the market with the highest energy density ever! Exxelia&#39;s revolutionary MML™ ultra-high energy density Film Capacitors are a game changer in the industry due to their unparalleled energy density of 400 J/dm3. This allows for a significant reduction in size and weight in comparison to traditional Polypropylene or Polyester dielectrics, as well as an increased operating temperature of up to 140°C and protection against transient voltage. Not only do MML™ capacitors offer a large flexibility in design, allowing for low profile configurations, but they have also been tested in actual cases for controls and DC-Links functions in aircraft applications and have shown a reduction in size and weight of about 50% compared to other film technologies.   Furthermore, when compared to MLCCs, MML™ capacitors have demonstrated a reduction in weight of between 70% to 90%, with no capacitance derating with voltage applied and a low drift of less than 5% across the temperature range. Applications that previously required clusters of stacked MLCCs can now be replaced by a single MML™ unit of similar size, with the added reliability that film dielectric offers. The exceptional properties of Exxelia&#39;s new MML™ capacitors make them suitable for a wide range of applications including power supplies, DC-links, AC/DC/AC power converters, charge/discharge or power generation functions of commercial/military aircraft, satellite platforms and payloads, launchers, defibrillators, downhole tools and any other applications that require confined electronics. Samples are available upon request.   Features & Benefits : Miniaturization of the function : Up to 50% size reduction vs other film technologies ; matching footprint with stacked MLCC Lightweight : 50% lighter vs other film technologies ; 80 to 90% lighter than ceramic No capacitance derating in voltage, stable in temperature (<5% drift through the temperature range) Capacitance from 1μF to 1000μF  Voltages from 50V to 1000V  Operating Temperature -55 °C to +140 °C Highly customizable   Get your white paper around our MML Film Capacitor Download our white paper now on our innovative Miniature Micro-Layer™ (MML™) technology, which offers the highest capacitance per volume for film capacitors available on the market, by filling out the form below.   Chargement&hellip;
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