Description du produit :
• Transfer-moulded encapsulation for higher reliability
• Power input max. 250 mW
• Isolation prim. to sec. 500 VDC minimum
• Suitable for IR and vapor reflow soldering
• SMD or through-hole cases
• Bandwidth : 100 KHz to 400 MHz
• Operating temperature - 55 °C to + 125 °C
• Weight : 1.5 grams
• Shielded version upon request

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